Presenting at the beginning of the month a new form factor motherboards for ultra-embedded systems, designated Em-ITX, VIA Technologies company has not become a long pull from the first demonstration of the development done in accordance with its specifications. Motherboard VIA EITX-3000 size Em-ITX will be displayed at the event ESC Silicon Valley 2009, which will take place from 31 March to 2 April in the United States.
New focus on the use of ultrathin high-performance embedded systems with passive cooling. According to the developer, it is operational in temperatures ranging from -10 to 70°C. To ensure a stable job boards in a wide range of temperatures helped with the deployment of the unique layout of the processor on the board.
In addition to low-voltage version of the processor VIA Nano (Ultra Low Voltage) there is a set of single-system logic VX800s VIA integrated graphics core of VIA Chrome9 HC3. Such an arrangement allows the use of more radiator area, away from the fan.
The company suggests installing on-board processor, two options: one is clocked at 1.0 GHz, while the other - at a frequency of 1.3 GHz. In the configuration of board member up to 2 GB of DDR2 memory modules in the form of SO-DIMM, dual adapter Gigabit Ethernet, implemented by the controller, VIA Velocity VT6130, two output LVDS (permission to 1280 x 1024 pixels) and one VGA (up to 1920 x 1440 pixels). Connecting drives provide two SATA ports and one slot for cards CompactFlash.
Sound Subsystem with support for HD Audio codec implemented in the VIA Vinyl VT1708B. Two USB 2.0 ports available on the front panel, four more - at the pin connectors on the motherboard. In addition, the available serial ports configurable RS-232/422/485. Add a set of input-output VIA EITX-3000 using the expansion card equipped with a EM-IO.Plata voltage converter, which opens the possibility of power sources AT and ATX.
The first samples EITX-3000 should reach to customers in early May.